FJN-1152 Organosilicone Resin
I Composition

    This resin is polymethyl siloxane type prepolymer via polymerization and fasculation of hydrolyzation and polymer of methyl chlorosilane and phenyl chlorosilane. This resin fits for heat resistant dope, H grade twin (one) fiberglass enveloping curve, insulated glass wax cloth of motor and airproofing glue of transistor.

II Main Technical Index

Item

Index

Appearance

Light yellow to mahogany transparent liquid, slightly white light is permissible

Mechanical Impurity

Non

Solid Content ?% ≥

55

Viscidity(coat-4cups) S 25℃

25~80

Drying Period 200℃ h ≤

1.5

Heat Resistance 200℃ h ≥

200

Loss on Ignition(25∝±2℃) h ≤

3

III Notice
1. Water, sulfur compound, pyridine and other impurity are forbidden in thinner of silicone or adhibiting force, dryness and other performances will be affected.
2. There will be a great deal of flammable and explosive products, such as toluene in the production process, enough attention should be paid, operators should be well protected.
3. All equipment and tools must be clean in the working process, while dust is strictly forbidden, or insulated performance of the products will be lowered.
4.Acid, alkali, salt and amine compound can speed up solidification of the resin and can affect heat resistance and electric performance of the paint film
IV Storage and Transportation
1.Pack with galvanized iron, 200kg/ barrel
2. Store at ventilated and dry place in shade to prevent from direct sunlight, acid and alkali pollution, fire and heat
3、Transport as flammable products

 

 
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